MediaTek Reveals Dimensity 8300 Chipset: Embracing Generative AI and Unveiling Stable Diffusion

The Dimensity 8300, MediaTek's latest CPU for Android handsets, was announced on Tuesday. It is built on TSMC's breakthrough second-generation 4nm manufacturing technology and has 20% better performance and 30% lower power consumption than its predecessor. The new chipset from the business supports complete generative AI, including large language models (LLMs) and technology like Stable Diffusion. According to the business, the chip enables up to 320-megapixel cameras and 5G network downlink speeds of up to 5.17Gbps.

This chip can compete with Qualcomm's second most powerful chip

The new Dimensity 8300 mobile CPU is an octa-core SoC with four Arm Cortex-A715 performance cores and four Cortex-A510 efficiency cores running at 3.35GHz and 2.2GHz, respectively. It supports LPDDR5x, UFS 4 storage, and Multi-Circular Queue (MCQ). Previous benchmark results indicate that this chip can compete with Qualcomm's second most powerful, Snapdragon 8 Gen 2 SoC.

In addition to the CPU mentioned above, the chip includes a Mali-G615 GPU that is said to utilise 55% less power while providing 60% better performance than last year's edition. According to the business, the processor also has MediaTek's HyperEngine game technology, which regulates device temperature and keeps the device from becoming too hot during gaming sessions.

MediaTek Dimensity 8300:It is compatible with smartphone cameras

The MediaTek Dimensity 8300 has an Imagiq 980 ISP for images and movies, which is said to enable 4K60fps HDR with support for more extended video recording due to power consumption improvements. It is compatible with smartphone cameras up to 320 megapixels in quality.

The Dimensity 8300 is outfitted with an APU 780 AI processor with a similar architecture as the more advanced Dimensity 9300 chipset, resulting in a 2x and 3.3x increase in INT/FP16 computation and AI performance, respectively. Meanwhile, according to the chipmaker, it enables on-device generative AI technology with up to 10 billion parameters and Stable Diffusion.

The new Dimensity 8300 supports 5G and 4G LTE connectivity using a 3GPP Release-16 modem. The processor also supports Wi-Fi 6E, Bluetooth 5.4, GPS, GLONASS, and NavIC for satellite navigation.

Conclusion

According to MediaTek, 5G devices powered by the recently disclosed Dimensity 8300 chip will be available by the end of the year. Qualcomm's Snapdragon 8 Gen 2 and Snapdragon 8+ Gen 1 chips are expected to compete with the chip. While particular models with the MediaTek processor have yet to be disclosed, we can expect smartphone manufacturers to release new models with the mobile chipset in the following weeks and months.