How Honeywell Thermal Interface Materials Solution Helps Keep  Smartphones Cool 

Honeywell announced the availability of a Thermal Interface Materials (TIM) solution to help smartphone manufacturers and designers manage heat dissipation in their phones. The worldwide smartphone market is expected to reach more than 1.9 billion units by 2020, according to a study from IDC Research. In addition, data needs are growing at unprecedented rates. To meet this challenge, the smartphone industry is leveraging technology that enables phones to provide optimal processing performance without overheating.

Honeywell’s TIM technology is based on phase change materials (PCMs). The technology transfers thermal energy from phone chips to a heat sink or spreader, where it is dissipated into the surrounding environment. This functionality keeps the chips cool, so the phone can perform reliably even during the most data-intense processes or during heat spikes. Honeywell’s solution is available worldwide and is already being used by some of the largest smartphone makers to upgrade the thermal designs of their latest phone models. Customers consistently choose Honeywell’s technology because it provides the best combination of performance and reliability to maximize the lifecycles of their devices, and is optimized to meet new and unexpected challenges.

“Honeywell’s TIM technology provides customers with the ideal solution to optimize their phones’ performances,” said Olivier Biebuyck, vice president and general manager of Honeywell Electronic Materials. “As demand for smartphones grows around the world, these breakthrough designs help provide optimal user experience throughout the entire lifecycle of their devices.”

Honeywell is a recognized leader in developing thermal management solutions. Honeywell’s proven PCM series of thermal management materials are based on sophisticated phase-change chemistry and advanced filler technology that was developed specifically for high-performing electronic devices. TIM products are designed to optimize thermal impedance across the entire thermal path, providing an end-to-end solution for best-in-class thermal performance. The PCM design can be customized to fit diverse product applications and end uses, providing customers with precisely what they need, when they need it.

Honeywell supplies microelectronic polymers, electronic chemicals, and other advanced materials along with an extensive set of product offerings under its metals business segment, including physical vapor deposition (PVD) targets and coil sets, precious metal thermocouples, and low alpha emissivity plating anodes and advanced heat spreader materials used during back-end packaging processes for thermal management and electrical interconnect.

For more information about Honeywell’s thermal management materials, or to contact a Honeywell representative, visit www.electronicmaterials.com.